ISO 20263:2017 Microbeam analysis and analytical electron microscopy for the determination of interface position in the cross-sectional image of the layered materials

    Introduction to ISO 20263:2017

    ISO 20263:2017 describes differential processing and intensity profiles from TEM/STEM images to compute the average interface position of multi-layered materials. The utilization of multi-layered materials in semiconductor devices, sensors, optical coatings, and functional materials is the main topic of this paper. Measurements of the overall thickness and thickness of individual layers are made using recorded pictures, which are a crucial criterion for product evaluation and verification. These cross-sectional photos can be used to calculate the averaged interface position between two distinct materials precisely. MaTestLab is one of the best testing service providers, with the best network of testing laboratories in the USA to carry out ISO 20263:2017 tests for our clients.

    ISO 20263:2017 Test Method

    Determining Interface PositionIt is crucial to objectively and uniquely determine the site of an interface in a layered material from its cross-sectional TEM/STEM/elemental mapping image. 
    Controlling FluctuationsAfter preparing the digital picture for TEM/STEM/elemental mapping, an average intensity line profile perpendicular to the interface is created. Slight noise is eliminated via moving-average processing, and the resulting intensity profile is then subjected to differential processing. The pixel coordinate on the x-axis determines the interface position.

    ISO 20263:2017 Test Specimens

    Specimen DetailTEM/STEM techniques are used to cut a cross-sectional thin slice perpendicular to the stacking direction of a multi-layered thin film to determine the materials’ interface properties.
    Specimen SizeThe cut-out angle α must be 90 ± 6 degrees to maintain the stacked material thickness information with a 1% accuracy.

    ISO 20263:2017 Test Results

    Using ISO 20263:2017 microbeam analysis and analytical electron microscopy, the interface position in cross-sectional images of layered materials is found by averaging the intensity line profile, moving-average processing to reduce noise, and differential processing to fine-tune the intensity profile.

    ISO 20263:2017 Related Tests

    ISO 20263:2017 applies to tests such as Transmission Electron Microscopy (TEM) and Fourier Transform Infrared (FTIR) spectroscopy.

    FAQ

    Where can I get the iso 20263 2017 tested?
    You can share your iso 20263 2017 testing requirements with MaTestLab. MaTestLab has a vast network of material testing laboratories, spread across the USA and Canada. We support your all material testing needs ranging from specific iso 20263 2017 test to various testing techniques.
    Please contact us for a detailed quote for your iso 20263 2017 testing needs. Cost incurred to carry out different iso 20263 2017 testing methodology depends on the type of raw material; number of samples, coupons, or specimens; test conditions, turn around time etc. Costs of some ASTM testing methods start from $100 and the final value depends upon the factors listed above. Please contact us for the best and latest prices.
    The required number of samples or specimens should comply with the procedure given in the iso 20263 2017 standard. However, the MaTestLab operations team can assist you for your special requirements once you share your testing details with us.
    MaTestLab has a vast testing laboratory network, hence we bring you the best testing facilities in a cost-effective way. We offer considerable discounts (15-20%) to our returning customers based on test volume and frequency.
    The turnaround time for iso 20263 2017 test methodology depends upon the test procedure mentioned in the standard test document. However, we at MaTestLab understand your research requirements and hence try to get your test completed within the least possible time.

    Updated on September 17, 2026

    Davis Scott
    About Author
    Davis Scott
    Davis Scott is an Electrical and Electronics Engineer specializing in multidisciplinary validation, quality assurance, and comprehensive electro-mechanical testing.
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