ISO 20263:2017 Microbeam analysis and analytical electron microscopy for the determination of interface position in the cross-sectional image of the layered materials

Name: Matestlab Inc.
Address: 2093 Philadelphia Pike, Claymont, Delaware, 19703, US
Telephone: (302)244-7710

Introduction to ISO 20263:2017

ISO 20263:2017 describes differential processing and intensity profiles from TEM/STEM images to compute the average interface position of multi-layered materials. The utilization of multi-layered materials in semiconductor devices, sensors, optical coatings, and functional materials is the main topic of this paper. Measurements of the overall thickness and thickness of individual layers are made using recorded pictures, which are a crucial criterion for product evaluation and verification. These cross-sectional photos can be used to calculate the averaged interface position between two distinct materials precisely. MaTestLab is one of the best testing service providers, with the best network of testing laboratories in the USA to carry out ISO 20263:2017 tests for our clients.

ISO 20263:2017 Test Method

Determining Interface Position	It is crucial to objectively and uniquely determine the site of an interface in a layered material from its cross-sectional TEM/STEM/elemental mapping image.
Controlling Fluctuations	After preparing the digital picture for TEM/STEM/elemental mapping, an average intensity line profile perpendicular to the interface is created. Slight noise is eliminated via moving-average processing, and the resulting intensity profile is then subjected to differential processing. The pixel coordinate on the x-axis determines the interface position.

ISO 20263:2017 Test Specimens

Specimen Detail	TEM/STEM techniques are used to cut a cross-sectional thin slice perpendicular to the stacking direction of a multi-layered thin film to determine the materials’ interface properties.
Specimen Size	The cut-out angle α must be 90 ± 6 degrees to maintain the stacked material thickness information with a 1% accuracy.

ISO 20263:2017 Test Results

Using ISO 20263:2017 microbeam analysis and analytical electron microscopy, the interface position in cross-sectional images of layered materials is found by averaging the intensity line profile, moving-average processing to reduce noise, and differential processing to fine-tune the intensity profile.

ISO 20263:2017 Related Tests

ISO 20263:2017 applies to tests such as Transmission Electron Microscopy (TEM) and Fourier Transform Infrared (FTIR) spectroscopy.

Updated on September 17, 2026

About Author

Davis Scott

Davis Scott is an Electrical and Electronics Engineer specializing in multidisciplinary validation, quality assurance, and comprehensive electro-mechanical testing.
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