ASTM B571 offers qualitative, mostly destructive, and semi-destructive testing that indicates whether a metallic coating is well bonded to its substrate and whether failures are adhesive (at the coating/substrate interface) or cohesive (within the coating). The practice does not yield a single numeric adhesion strength but a pass/fail or qualitative ranking, beneficial for production control, comparative studies, and acceptance of plated parts. There are several tests explained because coating, ductility of the substrate, and thickness all vary significantly; therefore, a standard test choice is made to fit the coating type and anticipated failure mechanism. In cases where direct testing of a completed part is not practical, B571 allows test panels plated in one production cycle to simulate the product item.
ASTM B571 Test Method
| Scribe/Grid | A sharp scribe or cutter makes intersecting cuts through the coating to the substrate (grid spacing chosen by coating thickness), followed by application and removal of adhesive tape to check for coating removal at cut edges; useful for thin, brittle coatings and for comparative acceptance. |
| Peel/Push/90° Peel | A tab of coating is lifted or a dolly bonded and pulled (or a mechanical fixture used for 90° peel) to observe whether the coating peels cleanly from the substrate; used when the coating will peel without tearing and to expose adhesive vs. cohesive failure. |
| Bend / Impact / File / Knife | Mechanical deformation (bending, impact, filing, or attempting to lift with a knife) stresses the coating/substrate bond to reveal flakes, cracks, or delamination; chosen according to substrate ductility and coating thickness and interpreted visually. |
